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Well spread paste is the coolest March 26, 2007

Posted by Al in : computers , trackback

IBM have been mucking around with chip design and have come up with a very simple solution to a long standing problem. It’s long been known that the thermal paste between your CPU and it’s heatsink is very important, but no-one had realised how much heat such paste can absorb and not conduct, particularly if not spread correctly. Now IBM have designed a set of microscopic grooves in the chip cap which helps the paste spread evenly, and so dissipate heat evenly. It’s a very simple idea, that should be very simple to incorporate into existing and new chip designs, and so should help CPUs run colder and with more power again.

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